The latest trend in electronic device industry points towards the compact and fast devices and to attain the same requirement, scientist from US are working on a novel technology-Nano technology.
The future processors are suppose to be more powerful and use less energy and a team at California University is working on a silicon wafers between five and 20 nanometres thick, which may be used in the designing of IC(Integrated Circuit) chips. The novel technology is based upon BCP(block co-polymer lithography).
According to the reports, microprocessor companies like Intel and IBM have invested billions of dollars in developing the new technology.
Shalini Ale/ITvoir Network
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